Home · Product · Wheel for Semiconductor

Wheel for Semiconductor

Wheel for Semiconductor
이미지명

For Sapphire Wafer

  • A.TEC Diamond
  • 2018-07-04 15:09:17
  • hit759
  • vote1
  • 175.198.128.202

▪ A combination of high rigid vitrified bond and strong grits of diamond are applied

Bond Type  Hybrid / Vitrified
Grit Size  #230, #270, #325, etc. 
Diameter  Ø150 ~ Ø450 
Thickness  7T , 10T , etc.
Grinding Type  Ring, Turbo wing, 3lines, etc.

 

* Turbo Wing Type 

 

 

 

 

 

 

                                   

                                          

                                              <Hybrid Bond>                                                         <Vitrified Bond>

 

* 3 Line Type

 

 

 

 

 

 

 

게시글 공유 URL복사
댓글작성

열기 닫기

댓글작성