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Wheel for Semiconductor

Wheel for Semiconductor
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For Sapphire Wafer

  • A.TEC Diamond
  • 2018-07-04 15:09:17
  • hit8601
  • vote5
  • 175.198.128.202

▪ A combination of high rigid vitrified bond and strong grits of diamond are applied

Bond Type  Hybrid / Vitrified
Grit Size  #230, #270, #325, etc. 
Diameter  Ø150 ~ Ø450 
Thickness  7T , 10T , etc.
Grinding Type  Ring, Turbo wing, 3lines, etc.

 

* Turbo Wing Type 

 

 

 

 

 

 

                                   

                                          

                                              <Hybrid Bond>                                                         <Vitrified Bond>

 

* 3 Line Type

 

 

 

 

 

 

 

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