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Wheel for Semiconductor
For Sapphire Wafer
- A.TEC Diamond
- 2024-04-19 15:09:00
- hit11731
- vote9
- 175.198.128.202
▪ A combination of high rigid vitrified bond and strong grits of diamond are applied
| Bond Type | Hybrid / Vitrified |
| Grit Size | #230, #270, #325, etc. |
| Diameter | Ø150 ~ Ø450 |
| Thickness | 7T , 10T , etc. |
| Grinding Type | Ring, Turbo wing, 3lines, etc. |
* Turbo Wing Type
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)
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<Hybrid Bond> <Vitrified Bond>
* 3 Line Type
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