▪  Fine grinding(Z2)  #4800, #8000, #10000, #30000 etc.

▪  Mirror face finish grinding

▪  Offer lower grinding resistance

▪  Less damage layer performance

▪  Keep smooth grinding with pore control  technology

▪  Less wafer warpage than conventional  resin bond wheel

- FV -  Grinding Wheel 

▪  Rough grinding (Z1) - #325, #400, #600, #1200 etc.

▪  Fine grinding (Z2) - #2000, #4000, #8000 etc.

▪  Ultra – high grinding quality 

▪  Reducing edge chipping and grinding damage

▪  Stable continuous grinding for high – load process